SOQuartz

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The SOQuartz

The SOQuartz is a RK3566 based compute module and parts of Quartz64 series.

Software releases

The SOQuartz software releases can be found in the article SOQuartz Software Releases.

SoC and Memory Specification

RK3566 icon.png

CPU Architecture

  • Quad-core ARM Cortex-A55@1.8GHz
  • AArch32 for full backwards compatibility with ARMv7
  • ARM Neon Advanced SIMD (single instruction, multiple data) support for accelerated media and signal processing computation
  • Includes VFP hardware to support single and double-precision operations
  • ARMv8 Cryptography Extensions
  • Integrated 32KB L1 instruction cache and 32KB L1 data cache per core
  • 512KB unified system L3 cache

GPU (Graphics Processing Unit) Capabilities

  • Mali-G52 2EE Bifrost GPU@800MHz
  • 4x Multi-Sampling Anti-Aliasing (MSAA) with minimal performance drop
  • 128KB L2 Cache configurations
  • Supports OpenGL ES 1.1, 2.0, and 3.2
  • Supports Vulkan 1.0 and 1.1
  • Supports OpenCL 2.0 Full Profile
  • Supports 1600 Mpix/s fill rate when at 800MHz clock frequency
  • Supports 38.4 GLOP/s when at 800MHz clock frequency

Neural Process Unit NPU Capability

  • Neural network acceleration engine with processing performance of up to 0.8 TOPS
  • Supports integer 8 and integer 16 convolution operations
  • Supports the following deep learning frameworks: TensorFlow, TF-lite, Pytorch, Caffe, ONNX, MXNet, Keras, Darknet

System Memory

  • RAM Memory Variants: 2GB, 4GB, 8GB LPDDR4.
  • Storage Memory: optional 128Mb SPI Flash and optional eMMC module from 8GB up to 128GB

Network

  • 10/100/1000Mbps Ethernet
  • WiFi 802.11 b/g/n/ac with Bluetooth 5.0

SOQuartz exposed peripherals

Displays / Cameras

  • 1x HDMI
  • 2x DSI
  • 1x eDP (Instead of HDMI1)
  • 1x LVDS (not available when dual-mode DSI)
  • 1x CSI 4-line

Connectivity

  • 1x Ethernet (1Gbit)
  • 1x USB 2.0 OTG
  • 1x SD Card (SD)
  • 1x PCIe 1-Line
  • 28x GPIO (TBD)

Connector Pins Definition

SOQuartz Model-A Baseboard Features

SOQuartz Model-A Baseboard
  • Model "A" Baseboard Dimensions: 133mm x 80mm x 19mm
  • Input Power: DC 12V @ 3A 5.5OD/2.1ID (IEC 60130-10 Type A) Barrel DC Jack connector

Storage

  • microSD - bootable, support SDHC and SDXC, storage up to 2TB
  • USB - 2 USB2.0 Host port

Expansion Ports

  • MiPi-CSI - 1x 2 lanes, 1x 4 lanes
  • MiPi-DSI - 1x 2 lanes, 1x 4 lanes
  • 2x20 pins "Pi2" GPIO Header
  • PCIe 1x open ended slot
  • 1x5 pin USB Expansion Header (J15)

GPIO Pins

Attention! GPIOs are 3.3V!

Interesting alternate pin configurations are listed in [brackets].

Assigned To Pin no. Pin no. Assigned To
3.3 V 1 2 5 V
[I2C2_SDA_M1] GPIO4_B4_3V3 a 3 4 5 V
[I2C2_SCL_M1] GPIO4_B5_3V3 a 5 6 GND
[GPCLK0] GPIO4_A4_3V3 7 8 GPIO0_D1_3V3 [UART2_TX_M0]
GND 9 10 GPIO0_D0_3V3 [UART2_RX_M0]
[I2S1_MCLK_M1] GPIO3_C6_3V3 11 12 GPIO3_C7_3V3 [I2S1_SCLK_M1]
GPIO4_A0_3V3 13 14 GND
GPIO4_A2_3V3 15 16 GPIO4_A3_3V3
3.3V 17 18 GPIO4_A1_3V3
[SPI3_MOSI_M0] GPIO4_B2_3V3 19 20 GND
[SPI3_MISO_M0] GPIO4_B0_3V3 21 22 GPIO4_B1_3V3
[SPI3_CLK_M0] GPIO4_B3_3V3 23 24 GPIO4_A6_3V3 [SPI3_CS0_M0]
GND 25 26 GPIO4_A7_3V3 [SPI3_CS1_M0]
[I2C3_SDA_M0] GPIO1_A0_3V3 a 27 28 GPIO1_A1_3V3 [I2C3_SCL_M0] a
GPIO3_A5_3V3 29 30 GND
GPIO3_D4_3V3 31 32 GPIO3_D6_3V3
GPIO3_D7_3V3 33 34 GND
[I2S1_LRCK_M1] GPIO3_D0_3V3 35 36 GPIO3_D5_3V3
GPIO3_D3_3V3 37 38 GPIO3_D2_3V3 [I2S1_SDI_M1]
GND 39 40 GPIO3_D1_3V3 [I2S1_SDO_M1]

Notes

  1. pulled high to 3.3V through 2.2kOhm resistor

Source: Page 11 of the board schematics.

USB Expansion Header

Pin no Assigned To
1 USB2_HOST_5V
2 HOST_DM3
3 HOST_DP3
4 GND
5 GND

Source: Page 10 of the board schematics.

SOQuartz BLADE Baseboard Features

SOQuartz BLADE Baseboard
  • SOQuartz BLADE Baseboard Dimensions: 200mm x 40mm x 15mm
  • Input Power:
    • DC 5V @ 3A 3.5OD/1.35ID (IEC 60130-10 Type H) Barrel DC Jack connector
    • PoE

Storage

  • microSD - bootable, support SDHC and SDXC, storage up to 2TB
  • USB - USB2.0 Host port (with header for setting OTG ID pin)

Expansion Ports

  • 2x20 pins "Pi2" GPIO Header
  • HDMI video output
  • M.2 slot
  • PWM fan header

Jumpers

  • OTG ID jumper
  • GPIO voltage, select 3.3V or 1.8V
  • PoE Enable

SOQuartz Module and Baseboard Information, Schematics, and Certifications

SOQuartz BLADE 3D Print 1U half width server rack
SOQuartz BLADE 3D Print 1U full width server rack

BLADE 1U rack 3D.jpg


SOQuartz module certifications:

Datasheets for Components and Peripherals

SOQuartz Module with various CM4 carrier boards

SOQuartz with DF Robot CM4 Carrier Board
SOQuartz with Waveshare CM4 Carrier Board
SOQuartz with Waveshare CM4 PoE Board


BSP Linux SDK

BSP Linux SDK ver 4.19 for Quartz64 model A SBC


Android SDK

Android 11 SDK for Quartz64 model A SBC


The Android 11 Stock images for SD boot for the SOQuartz module. This is test build.

Download:

  • Direct download from pine64.org (793MB, MD5 of the Gzip file be38ca999f9256bffd47d718f24003ab, build 20211112)

Notes:

The Android 11 Stock images for eMMC boot for the SOQuartz module. This is test build.

Download:

  • Direct download from pine64.org (793MB, MD5 of the Gzip file 3a29f0214898eed4d4e85e6ee8b9e4c7, build 20211010)

Notes:

  • Please unzip first and then using Rockchip Android tool ver 3.13 to flash in
  • For Windows OS environment please install the DriverAssistant v5.11 driver first
  • The OTG port located on USB 3.0 port, needs USB type A to type A cable.
  • Please allow 3-5 minutes boot up time on first time for initialization

How-To

Building Mainline U-Boot

See Quartz64 Building U-Boot.

Troubleshooting

This section provides information on troubleshooting various common issues you may encounter using the SOQuartz.

Thermal Issues

The SOQuartz SoM does not have a lot of copper to sink heat into. Therefore, it's recommended you use a heatsink such as the Waveshare CM4 Heatsink, the other Waveshare CM4 Heatsink, or the PINE64 Small Fan Type Heatsink. Please be aware that the Waveshare heatsinks may interfere with any eMMC module, unless you use very thick (2-3 mm?) thermal pads. Local resellers may sell CM4 heatsinks or small stick-on heatsinks, so there's no need to order them from abroad unless it's cheaper.

Alternatively, or in addition to this, a rectangle-shaped piece of 1 mm thick thermal pad can be sandwiched between the SoM and the carrier board. This allows the SoM to more efficiently sink heat into the larger mass of the base board.

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