PineBuds Pro

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Revision as of 11:42, 13 January 2023 by Liz 34 (talk | contribs) (Undo revision 15420 by Fxc (talk) I think there is so much demand for this that we should keep it here. When silicone case is ready, it will be moved to under heading Case or Silicone case or other.)
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The PineBuds Pro

The PineBuds Pro are open firmware capable ANC wireless earbuds. Some of the notable features include their light weight, 3 Microphones, ANC (Active Noise Cancellation), ENC (Environment Noise Cancellation) and high fidelity 6mm speaker. It is a fully community-driven side-project which anyone can contribute to, allowing you to keep control of your device even though hardware is proprietary.

Short overview / Specifications

Dimensions:

  • Earbud: WIP
  • Charging case: 70 x 50 x 35mm (source)

Weight:

  • Earbud: 5g
  • Charging case: 65g

IP Rating of Earbuds: IPX4
Dynamic transducer (speaker): 6mm
Microphone: 3 – FeedForward, FeedBack, Talk
System on Chip (in each earbud): BES 2300YP

  • CPU: Dual-core 300MHz ARM Cortex-M4F
  • ROM: 448KB
  • SRAM: 992KB
  • BT shared SRAM: 64KB
  • Flash: 4MB (Endurance erase cycles: >500)

Communication:

  • Bluetooth: Bluetooth 5.2 dual-mode compliant
  • USB: USB to dual UARTs at charging case

Battery:

  • Earbud: Built-in LiPo 3.7V 40mAh
  • Charging case: Built-in LiPo 3.7V 800mAh

Port:

  • Earbud: 4 pins
  • Charging case:
    • 4 pogo pins
    • USB type-C port 5V 500mA

Work in progress

Silicone case

Goal is to make a silicone case like this for PineBuds Pro.

"Design a mold, use a hobby 3D printer to manufacture it, then fill with silicone." (source)
"You can find a local hackspace or makerspace. Or you can use one of the many services available via the Internet who can print a model for you. Just design, upload, and pay." (source)
"The only one I know of is "https://www.pcbway.com/rapid-prototyping/injection-molding/"" (source)

Software releases

Firmware Images Build

Flash back factory default firmware using Windows based utility:

SDK Release

SoC and Memory Specification

BES-Tech.jpg

BES2300YP Block Diagram.jpg

SoC Architecture

Cortex-M4.png
    • CMOS Single-chip Fully-integrated RF, PMU, Audio CODEC and Cortex-M4F CPU
  • Memory Features:
    • 4MB Serial Flash On-chip for Custom Program
    • Internal ROM 448KB for critical constants and code
    • Internal SRAM 992KB for critical data and code
  • BT Features:
    • Bluetooth 5.2 dual-mode compliant
  • Audio Features:
    • Support BES Intelligent Bluetooth Retransmission (IBRT)
    • Support FF/Hybrid ANC
    • Dual MICs noise reduction
    • Echo Cancellation
    • Support low power voice activity detection
    • Multi-band EQ and Bass enhancement
    • Support Active Crossover
    • Support TWS
    • HiFi Stereo Audio DAC: 120dB SNR, 110dB DNR
    • HiFi Stereo Audio ADC: 100dB SNR
    • Sample rates from 8 kHz to 384 kHz
    • Support dual/single Mic noise suppression
    • Support ambient awareness
    • Support talk through
    • 24-bit audio processing
  • PMU Features
    • 3.1V-5.5V Input for VBAT
    • Internal LPO for low power mode.
    • DCXO with internal oscillator circuit
    • Internal temperature sensor

Information, Schematics and Certifications

Datasheets for Components and Peripherals