PinePhone component list

The following list of components are found in the schematic for the PinePhone 1.2a.

Abreviations used in schematic

The following abbreviations are used as the starting letter(s) to identify the components in the PinePhone schematics:

• ANT: antenna
• C : capacitor
• D : diode
• DU : Only used in the "DU1", which is an integrated circuit for memory
• ED : Zener diode to protect against electrostatic discharge
• FB : ferrite bead
• J : wire link (i.e. a connector)
• R : resistor
• L : inductor
• NC/ : not connected (i.e. the part probably isn't placed on the board, but there are circuits in the PCB for it)
• Q : transistor
• SW : switch
• TP : test point
• U : integrated circuit (i.e. a silicon chip)
• X : crystal oscillator (used for clocks)

P.4 LPDDR3 FPGA178

• DU1:
  Artmem ATL3A1632H12A 2GB 800MHz LPDDR3-1600 SDRAM, FBGA-178 11.0x11.5x0.93 mm
  Note: RAM will be clocked slower at 667MHz, because the Allwinner A64 only supports up to 3GB LPDDR3-1333.
  

P.5 CPU

• U1:
  Allwinner A64 1.2Ghz 4x Cortex-A53, 64-bit, superscalar, 32KB instruction & 32KB data L1 cache per core, 512KB L2 shared cache, ARM Mali-400 MP2 (Utgard) GPU, HDMI 1.4 (up to 4K@30), USB 2.0 with OTG, MIPI CSI, 4 channels in/out, 24-bit, 8-48 KHz audio, video encode: H.264 1080p@60, video decode: H.265 4K@30, H.265 1080p@120, H.264, MPEG1/2/4 / VP8 / AVS / AVS+ 1080p@60, FBGA-396 15x15 mm
  Note: Clocked at 1.152Ghz on the PinePhone.
• X501:
  Axtal AXX3225 24MHz ±10ppm quartz crystal oscillator in SMD package, 3.2x2.5 mm
• D500:
  Will Semiconductor ESD5451X 1-line, bi-directional, transient voltage suppressor, EDS protection up to ±30kV and 8A.
• X500:
  Seiko Instruments Inc. (SII) SC32S 32.768KHz crystal oscillator
  Note: Not clear if using the SC32S-12.5PF20PPM or the SC32S-7PF20PPM
  

P.6 POWER

• ED600:
  Will Semiconductor (WILLSEMI) ESD5451X 1-line, bi-directional, transient voltage suppressor, EDS protection up to ±30kV and 8A.
  Note: This part is marked as optional in the schematic and may not be included.
• U600:
  X-Powers AXP803 power management integrated circuit (PMIC) optimized for multi-core systems, li-ion battery fuel gauge, USB charger (up to 2.8A), QFN 68-pin, 8x8 mm
• Q600:
  Will Semiconductor WPM1481 single P-channel, -12V, -5.5A, power MOSFET
• J600:
  BA5924211-R battery connector
  Note: Picture shows this part as having 8 pins, but the schematic shows 6 pins. One page says that it is made by LateralPressure, but another says it is made by ROHM.
• L606:
  IND_252010 2.2uH-2A inductor
  Note: Maybe this is the TDK VLS252010HBU
• U601:
  LowPowerSemi LP6226CB6F high efficiency boost DC/DC converter with 33V, 1.5A power MOSFET, SOT23-6 package
• D600:
  On semiconductor SS24 Schottky power rectifier, SOD123 package
  

P.7 NAND/eMMC

• U700:
  Kimtigo KM110SS0016GxA-DDD00WT 16GB eMMC 5.1 TLC NAND Flash memory, FBGA-153 11.5×13.0×1.0 mm.
  Note 1: The schematic says the package is BGA-169, but the Kimtigo documentation says it is FBGA-153.
  Note 2: The A64 only supports up to eMMC 5.0.
  

P.8 AUDIO

• ED800, ED801, ED802, ED803, ED804, ED805, ED806:
  Will Semiconductor ESD5451X 1-line, bi-directional, transient voltage suppressor, EDS protection up to ±30kV and 8A.
• U801:
  Broadchip BCT4717ETB-TR 4.0Ω, 300MHz bandwidth, dual bi-directional SPDT (single-pole/double-throw) analog switch
• J800:
  EAROUTN-A64 receiver
• J801:
  JA-3606-001AA 3.5mm audio jack
• Q801:
  Toshiba SSM3K35MFV field-effect transistor, silicon N-channel MOS type
• U800:
  Shanghai awinic technology AW8737SCSR high efficiency (80%), low noise (53μV), ultra-low distortion (0.008%), constant large volume, 7th generation class K audio amplifier, 1.6×1.68 mm CSP-14 package, 0.4mm pitch [datasheet]
• FB800, FB801:
  600ohm at 100MHz ferrite bead (examples)

P.9 T-CADD/USB

• Q901, Q902, Q903:
  Toshiba SSM3K35MFV field-effect transistor, silicon N-channel MOS type
• ED900, ED901, ED902:
  Will Semiconductor ESD5451X 1-line, bi-directional, transient voltage suppressor, EDS protection up to ±30kV and 8A.
• J901:
  SA-2202-112 25-pin microSD and TF slot
  

P.10 CAMERA

• J1000:
  T03-1025-FG01 27-pin connector to the rear camera.
  Note: The schematic says “GC2035-200W”, which is a mistake because the rear camera is the OmniVision OV6540.
• J1001:
  T03-1025-FG01 27-pin connector to the front camera.
  Note: The schematic says “GC2035-200W”, which is a mistake because the rear camera is the GalaxyCore GC2145, not the GalaxyCore GC2035.
• U1000:
  Shanghai awinic technology AW3641EDNR flash LED driver with programmable timer and PWM dimming torch mode, 1A, 8 current levels.
  

P.11 LCM/CTP

• J1100:
  FPC24-PT05B, OK-24F-04 28-pin connector to the MIPI DSI LCD
• LED2:
  RGB LED
• J1101:
  CON6-0.5, TP_6PIN-ZQ01 8-pin connector to the capacitive touch panel controller
  Note: The label says that the connector has 6-pins, but the schematic shows 8-pins.
• ED1100, ED1101, ED1102, ED1103:
  Will Semiconductor ESD5451X 1-line, bi-directional, transient voltage suppressor, EDS protection up to ±30kV and 8A.
• U1100:
  Chipown AP3127B025 step-up DC/DC converter series, white LED backlight driver, 6-pin SOT-23-6L package.
  

P.12 SENSORS/MT/KEY

• J1200:
  8-pin connector to test points
• ED1200, ED1201:
  Will Semiconductor ESD5451X 1-line, bi-directional, transient voltage suppressor, EDS protection up to ±30kV and 8A.
• U1200:
  STmicroelectronics LIS3MDL ultra-low-power three-axis magnetometer, LGA-12 2.0x2.0x1.0 mm [datasheet]
• U1201:
  SensorTek STK3311-A proximity and ambient light sensor (large gap) with built-in infrared LED, DFN-8 3.94x2.36x1.35 mm [datasheet]
• U1202:
  TDK InvenSense MPU6050 six-axis, low-power MEMS gyroscope and accelerometer, QFN-24 4x4x0.9 mm [datasheet]
• U1203:
  Asahi Kasei Microdevices (AKM) AK09911 3-axis electronic compass IC with Hall sensor, 8-pin WL-CSP (BGA), 1.2×1.2×0.5 mm
  or
  Voltafield Technology Corp. (VTC) AF8133J 3-axis electronic compass with proprietary anisotropic magneto resistive (AMR) technology, 8-pin WLCSP 1.2x1.2x0.5 mm
  Note: Both parts are listed, so have to check PCB to see which was used. It is not clear why this part is needed when the device already has the LIS3MDL.
• U1204:
  Bosch Sensortek BMI120 3-axis gyroscope and accelerometer, LGA-14 2.5x3.0x0.83 mm
  Note: Listed as “NC/BMI120”, where “NC” probably means “not connected”, so there may be circuits in the PCB for the part, but it is not placed on the board. This is probably an alternative to the MPU6050.
• Q1200:
  Toshiba SSM3K35MFV field-effect transistor, silicon N-channel MOS type
• D1200:
  Torex XBS104S14 Schottky barrier diode, 1A, 40V, SOD-123A package
• J1201:
  2-pin connector to a motor, 1x1.8 mm
  Note: Presumably this is a vibration motor.
  

P.13 DIGITAL VIDEO

• J1300:
  OK-50F-04 40-pin connector
• U1304:
  Analogix ANX7688 HDMI to USB-C bridge with MUX, converts HDMI 2.0 to DisplayPort Alternate Mode, USB-C Power Delivery (PD), BGA-64.
  Note 1: The schematic lists this part as “ANX7688S”, but it is unclear what the “S” at the end stands for.
  Note 2: xnux.eu provides more info on the ANX7688, including flashing the firmware.
• U1300:
  America Techcode Semiconductor TD6817 1.5MHz 2A synchronous step-down regulator dropout, SOT23-5 package
  or
  Diodes Incorporated AP3406K-ADJTRG1 buck switching regulator IC positive adjustable 0.6V 650mA [datasheet]
• U1302:
  LowPowerSemi LPW5206H USB power loading switch, N-channel MOSFET, SOT23-5 package
• U1303:
  Texas Instruments TXB0104YZT 4-bit bidirectional voltage-level translator with automatic direction sensing and ±15-kV ESD protection, 12-pin DSBGA 1.40×1.90 mm
• Q1300, Q1301, Q1302, Q1304, Q1305:
  Toshiba SSM3K35MFV field-effect transistor, silicon N-channel MOS type
• U1305, U1309:
  Will Semiconductor WS4621C-1X1 2A, 38 mΩ, 290nA quiescent current and 70nA standby current load switch, CSP-4L 1x1 mm.
• U1308:
  Shanghai awinic technology AW3632 high efficiency, low profile, fixed 5V output pump power supply, QFN-8 package
• X1300:
  Mercury United Electronics X3225 27.000 MHz crystal oscillator
  

P.14 WIFI+BT

• U1400:
  Realtek RTL8723CS 802.11 b/g/n, single-band (2.4 GHz), Bluetooth 4.0, with SDIO for WiFi and UART for Bluetooth, LGA-40 12x12x1.6 mm.
• X1400:
  24Mhz ±10ppm crystal oscillator
• D1400:
  SXSEMI AU0511P1 low capacitance ESD protection diode, SOD-882
• ANT1400
  Antenna
  

P.15 MODEM-4G

• U1500:
  Quectel EG25-G GSM/UMTS/LTE cellular modem and GNSS (GPS/Galileo/GLONASS/BeiDou/QZSS, with A-GPS), LGA-144 9.0x32.0x2.4
• U1502, 1503, 1504:
  Texas Instruments TXB0104YZT 4-bit bidirectional voltage-level translator with automatic direction sensing and ±15-kV ESD protection, 12-pin DSBGA 1.40×1.90 mm
• Q1501, Q1503, Q1504, Q1505:
  Toshiba SSM3K35MFV field-effect transistor, silicon N-channel MOS type
• J1500, J1502:
  MRF004-P01A 4-pin connector
• Q1500:
  Will Semiconductor WPM1481 single P-channel, -12V, -5.5A, power MOSFET
  Note: The documentation shows 6 pins, but the schematic shows 8 pins.
  

Other components not in the schematics

• SGMICRO SGM3140 500mA buck/boost charge pump LED driver for camera flash and torch, TDFN-10 3x3x0.75 mm
• Goodix GT917S touch controller
• Sitronix ST7703 MIPI LCD driver
• Xingbangda XBD599 5.99″ IPS LCD, 720x1440 pixels, 16.7M colors, hardened glass